Development of packaging technologies for advanced SiC power modules

A set of packaging technologies has been developed for promotion of SiC power devices in automotive applications. The technical advances include integrating single side cooling, three-dimensional (3-D) planar electrical interconnection, and integrated double sided direct cooling. The further integration of these features into one packaging process has been demonstrated with highly integrated SiC phase leg power module prototypes. The comprehensive improvements in module's electrical, thermal performance and manufacturability help exploit fully the attributes provided exclusively by the wide bandgap (WBG) power semiconductors. The technical advancements lead to cost-effectiveness, high efficiency, high power density power conversion in electric drive system in modern vehicles.