Packaging technologies to exploit the attributes of WBG power electronics

1)Power electronics packaging is critical to exploit the superior attributes of the wide bandgap (WBG) power semiconductor devices; 2)Highly comprehensive system requirements need advancements on all aspects of packaging technology: electrical, thermal, thermo.mechanical performance; 3)Integration of thermal management, high temperature, high reliability for cost.effective WBG power modules is an promising approach; 4)Advancing materials, innovative cooling mechanism, modern fabrication processing are a few among the key technologies.