Laminate based LED module with embedded MOSFET chips

The AC power supply of an LED lighting system is usually a separate device which is typically several times bigger than the LED light source itself. We present a novel system integration approach that eliminates this separate device. In this novel approach we integrate the LED array and the power supply unit into one single module using a technology mix of laminate based chip embedding, surface-mount devices (SMD) and chip-on-board (CoB) technologies.