Technological optimization of the microwave hybrid and monolithic integrated circuits

The methodology of increasing of serial applicability indicators and reliability of microwave hybrid and monolithic in-tegrated circuits (HIC and MIC) is offered. The modern MIC element base consists of multilayered semiconductor heterostructures. The methodology is based on modeling of degradation processes of microwave HIC and MIC heterostructure under the influence of external factors and development of technological optimization methods.