A semi-coaxial TGV interposer for high frequency 3D system applications

This article describes a semi-coaxial through glass via(TGV) interposer structure for high frequency three dimensional(3D) system applications. In order to overcome impedance mismatch in high frequency transition, a semi-coaxial structure is designed. The glass is 200 μm thick and the via's diameter is 50 μm. Re-distribution layer (RDL) line to TGV transition structure is designed and simulated to estimate the loss and crosstalk. Simulation results shows that this structure has very good performance up to 35 GHz. The S11 is less than -30dB and S21 is more than -0.1dB. This TGV interposer can be used for 3D milimeter wave IC intergration.