Applications Of Liftoff Technologies For Optoelectronic Circuits

Optoelectronic circuits will be very important in the decade of the 1990s. Materials will play a major role. There is presently a need to integrate photonic devices made from III-V materials with foreign substrate materials for various signal processing applications. There are three different approaches; hybrid bonding, heteroepitaxy and epitaxial liftoff. In this paper, the relative merits and status of these three approaches will be discussed, with special emphasis on liftoff technologies.