Multi-Chip Module (MCM-D) using thin film technology

This work presents results of the Multi-Chip Module-Deposited technology built with thin film processes over a substrate of alumina and oxidized silicon that was used to micro-fabricate passive components (capacitors, resistors, inductors). Metal layers were deposited by sputtering, electrolytic and electroless techniques and benzocyclobutene was used as dielectric. Electrical characteristics of passive components and filters were evaluated indicating that the testchip and processes were effective to manufacture the devices.