Thermal simulator benchmarking using an SOIC package

Benchmarking on three thermal simulators representing the finite element and boundary element methods is conducted to assess their performance for solution of the equilibrium die temperature of a SOIC (small outline integrated circuit). Accuracy and efficiency (speed, meshing, and cost) are compared for the simulators. Compatibility with other CAD (computer aided design) tools such as solid modeler and CFD (computational fluid dynamics) is also investigated.