Influence of overall dimensions and materials of a switchboard on the thermal field distribution

This paper employs a computer model for investigation of the thermal field in a low voltage (LV) switchboard. The model has been synthesized in the software product Comsol. The thermal field has been modelled taking into account the thermodynamic processes and heat transfer by radiation in the volume of the LV switchboard. Comparison has been drawn between the results, obtained from the model and the results of the experiment. Results, concerning the influence of both the volume and the material of the enclosure on the switchboard heating have been obtained by means of the computer model.