Flip-chip interconnects based on solution deposited carbon nanotube bumps

A solution based fabrication process of carbon nanotube (CNT) bump interconnects is proposed. In comparison to CVD growth of CNT which requires high process temperature, the proposed process has the advantage of being capable to fabricate CNT bumps at room temperature with relatively high resolution and adjustable bump height. The average resistance of the fabricated CNT bumps was measured to be 904 mΩ, comparable to the resistance of the transferred CVD grown CNT bumps.