Upgrades of the HL-LHC/ATLAS hybrid pixels detector: Test results of the first 3D-IC prototype

Vertex detectors for High Energy Physic experiments require pixel detectors featuring high spatial resolution, very good signal to noise ratio and radiation hardness. A way to face new challenges of the upgrades of HL-LHC/ATLAS future hybrid pixel vertex detectors is to use the emerging 3D Integrated Technologies. However, commercial offers of such technologies are only very few and the 3D designer's choice is then very much constrained. Moreover, as radiation hardness and in particular SEU tolerance of configuration registers is a crucial issue for HL-LHC vertex detectors and, as commercial data on this point are always missing, a reliable qualification program is to be developed for any candidate technology. We will present the test results of GlobalFoundries, 130 nm chips processed by Tezzaron Company, submitted within the 3D-IC consortium. Reliability and influence of these 3D connections on integrated devices behavior has also been addressed by tests.