High-performance cooling system with multi-channel electro-osmotic flow pumps for high-power 3D-ICs

A multi-channel electro-osmotic flow (EOF) implemented to the closed-channel cooling system (C
³
S) has been developed for thermal management of stacked chips (3D-ICs). The EOF pump, which was fabricated using MEMS technology, provided driving capabilities of fluid flow through the micro channel at the P
_max
of 1 × 10
⁴
Pa and Q
_max
of 38 μl/min. Cooling capability as high as 140 W/cm
²
was demonstrated for the first time.