Electrical-thermal co-simulation for power redistribution layers of interposer with through-silicon vias

In this paper, an TSV (Through-Silicon Via) Interposer with signal distribution networks (SDN) and power distribution networks (PDN) is proposed. And the temperature-dependent electrical resistivity of conductors and the Joule heating effect of the interposer are analyzed using the electrical-thermal co-simulation method. The simulation results show that the temperature effect on IR (voltage) drop is significant and can not be neglected.