Integration and optimization of 300 mm backside TSV revealing and Cu redistribution process enabled by ZoneBOND temporary bonding technology

In this paper, we investigated the integrity and compatibility of various temporary adhesives using ZoneBOND technology for 3D TSV integration. Optimization of 300 mm TSV revealing and subsequent backside process have been investigated, including the temporary bonding, wafer thinning, Si recess etching, backside passivation, wafer planarization, backside Cu redistribution layer (RDL), and solder bumping fabrication.