A case study of package delamination with combination of EDX and MiniSIMS

A case study for delamaination surface is provided by combination of EDX and MiniSIMS. EDX can provide near surface composition analysis up to 3 μm while MiniSIMS can give nanometer thickness surface characterization with molecular and structural information at ppm sensitivity. This combination is crucial to find the root cause for the delamination, a common failure mode observed in the IC package. This method is easy for the industrial user to find the root cause especially for the over oxidation on the leadframe, contamination etc. efficiently.