Novel 3D die-stacked opto-electronic transceiver ICs that allow for waferscale fabrication

Optical interconnects can offer small footprint, high bandwidth density and high data rates. In this paper we demonstrate a wafer scale fabrication process of the 3D stacked transceivers which leads to very high bandwidth density as well as potential low cost. Uniform open eye patterns at 10 Gb/s/channel of both 3D stacked transmitter and receiver ICs indicates that the interconnection technology suggested is robust.