Multichip-modules (MCMs) for micro- and millimeter-wave applications-a challenge?

Multichip modules (MCMs) and MCM technologies are very close to micro- and millimeter-wave systems, such as T/R modules for active phased array radar and communication modules for wireless infrastructure links. There are various stringent requirements for MCMs in the frequency range of 1 to 100 GHz, but the most critical requirements are optimized thermal management adapted to the desired power consumption, matching between given geometry and space and the MCM architecture, and the ability to achieve high yield and high volume production. This paper discusses different MCM technologies applicable for the realization of T/R modules and communication modules. An overview of micro- and millimeter-wave product families and solutions for module realization and MCM-D technology currently available at Daimler-Benz Aerospace is given. We share our experiences and visions for next generation front-ends, while comparing practical solutions and existing technologies of other companies in the micro and millimeter-wave market. Aspects such as assembly, packaging, testing and MMIC/ASIC connection techniques (flip chip/wire bonding) are also discussed.