Verification of an LTCC packaging technology on board of the ongoing TET-1 satellite mission

Over the last years an innovative packaging technology for space applications based on Low Temperature Cofired Ceramics (LTCC) has been developed under the patronage of the German Space Agency (DLR). This technology is characterized by small hermetically sealed modules that hold elementary (sub-) functions of RF-systems. This design philosophy ensures a high reusability and thus an efficient product development. The modular circuit concept facilitates lower costs and reduced weight for satellite communication applications compared to standard technology. The KERAMIS® technology has been developed in a series of funded research projects resulting in specific experiments for verification in space. Each experimental board consists of a multilayer PFTE substrate with mounted LTCC modules on top and combining RF-, DC- and digital functionality. As these experiments consist of several to dozens of LTCC modules the second level interconnections between ceramic substrate and PTFE form a very important part of the package. Here, interconnects using LGA and wirebond processes have been developed that both provide operation up to Ka band frequencies. In order to verify the technology a demonstrator system incorporating multiple synthesizers and amplifiers has been developed, qualified and launched into space as part of the German TET-1 On-Orbit Verification (OOV) mission. In this paper, a wrap-up of the package technology is given and verification results acquired since the start of the mission in July 2012 are presented.