A numerical model using the phase field method for stress induced voiding in a metal line during thermal bake

We present a numerical model using the phase-field method (PFM) for stress-induced-voiding (SIV) in a metal line. The model was verified by comparison with the typical stress-migration (SM) analytical model. We investigated the effects of flaw location and density on time-to-failure (TTF). The model was applied to the failure analysis of the BEOL process of a 0.13um device for automobiles.