New technique of interlayer dielectric CMP with capping layer

A new technique of interlayer dielectric (ILD) planarization with chemical mechanical polishing (CMP) has been developed. The feature of this technique is to remove the step height more efficiently by making use of the polishing rate difference between two films deposited before CMP process. As compared to conventional process, the thickness of insulating layer before polishing can be reduced and the planarized surface can be obtained in shorter polishing time. This technique is one solution for CMP throughput and cost problem.