Design optimization of light emitting diode module «chip-on-board» for light extraction increase

In the present research we optimize the design of light emitting diode module produced using ≪chip-on-board≫ (COB) technology to reduce light energy losses in elements of the module. Optimization was performed using numerical simulations and experimental study of COB samples. Calculations predict that the enhancements of light extraction from COB with the optimized shape of encapsulating cover compared to the flat encapsulated COB reach 10-15% depending on type of the substrate plate reflection. Experiments show higher values (up to 18%) of the enhancements of light extraction.