Trends in BGA design methodologies

Ball grid array packaging has emerged as the technology of choice for high I/O count ICs, delivering high density and yield without requiring fine-pitch processing or new assembly equipment. Many similarities exist between these advanced packages and traditional printed circuit boards, but the design process is not one of them. Incorporating one or several complex ICs into a BGA package is dramatically different to placing and routing a traditional PCB, presenting design issues that existing tools and processes can not address. In addition, consumers of these package designs require that the suppliers provide good characterization data for electrical and thermal performance of the design. It is therefore important to integrate analysis of these issues into the design process. This paper examines the physical design process and the evolution of design software from nonintelligent graphic tools to dedicated advanced packaging design systems with integrated analysis tools.