MCM-D implementation of passive RF components: Chip/package tradeoffs

MCM-D technology offers the capability to integrate passive components with ICs. Currently, most application volume is in a frequency range between 800 MHz and 2 GHz. On-chip integration of inductors in this range poses particular problems because of the conflicting needs for small size and high quality factor. MCM technology offers a way to tightly integrate inductors and capacitors in a more cost-effective fashion. To use this approach to its best advantage requires closely coupled design of ICs and substrate and calls for new design methodologies that can work across different technologies.