Electronic packaging challenges for emerging devices

With the ever-growing demand for faster and greater computational power and increased functionality and intelligence in electronic products, next generation devices and systems are undergoing a vast transformation in a fundamental sense. Gone are the days of traditional devices based on integrated circuit technology alone and operating solely in the electric domain. New concepts are emerging in the horizon which indicates the merging of multiple physical domains and technologies on a single chip. With sustainable energy and efficient health care growing into two of the most important challenges of this century, established semiconductor techniques are being reused in newer fields like solid state lighting and medical devices to extend the range and scope of current technology. These developments are driving system level heterogeneous integration and smart microsystems which in turn impose new challenges in packaging and assembly. This presentation aims to discuss some of the relevant directions in this scenario with the help of some implemented examples.