Multi-physics simulation of the component attachment within embedding process

With the trend towards increasing complexity of Printed Circuit Boards (PCB), there has been considerable interest of investigation of the embedding process. The main focus has been set on the first step, the chip attachment by using an adhesive. Investigation of the adhesive thickness underneath the component by a numerical and an analytical model has been provided. The numerical model was produced with commercial program Ansys FLUENT. The results of both models are compared with experimental data to validate the models.