Improved reliability and switching performance of atom switch by using ternary Cu-alloy and RuTa electrodes

For the first time, Cu(AlTi)-alloy active-electrode coupled with RuTa inert-electrode is proposed to improve the reliability of nonvolatile Cu atom switch. The remarkably high rupture temperature (T
_r
>400
^o
C) of the nanometer-scale Cu bridge with the high thermal resistance (R
_th
) is realized by the Cu-alloy without increasing programming current. The anti-Cu diffusive, RuTa-alloy improves the retention of the ON-state at 150
^o
C and endurance to >10
⁴
cycles. The metallurgical prescription is a key to improve the reliability and switching performance of the conducting bridge.