Analysis of new lead-free solder alloy microstructure

Combining with the analysis of solder melting point, spreading rate and tensile strength, a new Sn-Zn lead-free solder system has been developed. The solder melting point is 183 °, it is very close to Pb-Sn eutectic solder melting temperature, the corresponding melting range of this solder is smaller, and it has higher bonding force and other advantages, completely meeting the requirements of the electronic industry. Because the material performances are Influenced by the microstructure, so the alloy microstructure was investigated, and the influencing factors of the alloy microstructure on properties have been found.