CoolMap: A Thermal-Aware Mapping Algorithm for Application Specific Networks-on-Chip

Researches demonstrate that overheating can raise the risk of failure in electrical chips. Also, increasing processing demand of applications increase the number of IPCores inside the chips and subsequently make them being tightly coupled, which in turn can intensify the thermal issues. In this paper we propose an application specific temperature-aware mapping algorithm which maps IPCores such that thermal correlation between them would be taken as minimum with considering the performance impact. Simulation results show that the average peak temperature is reduced while applying our mapping onto four application graphs. Moreover the communication cost and energy consumption are also reduced.