Development of linear roll CMP system for large area micropatterns

Micro patterns are required to be fabricated on non-semiconductor fields such as MEMS, LCD, printed circuit board, ultrathin and flexible continuous substrates. CMP technology is mainly concentrated on requirements beyond 30nm technology node on 300mm wafer diameter. Large area - over 450mm sized - substrate has a couple of issues including cost of consumables and removal uniformity. A novel linear roll CMP system was developed to make up for these defects. Micro copper patterns on flexible substrates need to be filled in less than 10 um trenches. Copper electroplating procedure is the next step to nickel electro-less plating process as a seed layer. This paper deals with nickel polishing for the more effective copper filling method. Experimental results show feasibilities of large area and flexible substrates using a linear roll CMP system. SEM images prove its feasibility.