Case studies on application of Time Resolved Imaging Emission Microscopy for backside timing analysis

We studied a backside timing analysis technique utilizing Time Resolved Imaging Emission Microscopy (TRIEM) which can acquire emission data locations and timing simultaneously from an activated LSI chip. In this paper, we will present two case studies of actual failed chips. One is a delay fault case, and the other is a current fault case. Then, we will propose an analysis flow applying TRIEM based on the experimental results.