Corrosion criteria for electronic packaging. III. Corrosion by package family

For pt.II see ibid., p.1098-104, Dec. 1990. The reaction path for catastrophic corrosion requires both condensed moisture and ionic contamination. It is shown here that package types ranging from hermetic ceramic to plastic cavity can be configured reliably as long as materials and assembly methods do not result in the presence of both condensed moisture and ionic contamination on the surface of the encased silicon chip.<
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