Electrical characterization of a 25 Gbit/s VCSEL module with TO-46 form factor packaging

A cost-effective differential-mode packaging of the TO-46 VCSEL module is proposed. The optimal bonding-wire and package solution have been demonstrated through frequency-domain and time-domain simulations. The differential-mode modulation bandwidth of the VCSEL module of above 21 GHz is achieved and a clearly opening eye diagram of 25 Gbit/s is observed. The electrical characterization of the VCSEL module under different driven source impedances is simulated and discussed.