3D stacked microfluidic cooling for high-performance 3D ICs

Cooling is a significant challenge for high-performance high-power 3D ICs. hi this paper, we describe the experimental evaluation of 3D ICs with embedded microfluidic cooling. Different architectures are experimentally evaluated ine hiding: 1) a memory-on-processor stack. 2) a processor-on-processor stack with equal power dissipation, and 3) a processor-on-processor stack with different power dissipation, hi all cases, embedded microfluidic cooling shows significant junction temperature reduction compared to air-cooling.