Mean time to failure of SnAgCuNi solder joints under DC

Electromigration time to failure and electrical resistivity of 95.5%Sn-1.5%Ag-0.5%Cu-0.03W%Ni (SACN) microelectronics solder joints have been investigated experimentally. A Black's type electromigration time to failure equation is developed to describe the time to failure versus current density and temperature. The activation energy over the range of 83°C~174°C is measured to be 0.77±0.12eV, and the current density exponent is found to be (8.60±1.65). It is also shown that the most commonly used Black's electromigration time to failure equation cannot be used for solder joints.