Bondability of copper wires on PPF leadframe

The imposition of lead-free production for most of electrical and electronic components in the 2006 EU legislation has lead to leadframes manufacturers looking into other solderable alternatives for PCB soldering assembly. One of the alternatives is Tin (Sn) plating but it brings along other risks such as whisker growth. Nickel palladium (NiPd) based PPF (Pre-Plated Finishes) leadframe becomes another feasible option with no Sn-whisker risk. This introduction has greatly economized the cost of IC assembly by eliminating the post-mold plating process.