Reliability of Planar SKiN Interconnect Technology

The classical module design is limited in lifetime by solder interfaces and wire bond technology. The elimination of the traditional base plate and the replacement of solder interfaces by a high reliable Ag sinter technology led to the first 100% solder free module. The SKiN technology eliminates the last obstacle to a significant lifetime and reliability improvement: the wire bonds. It additionally replaces the interface to the heat sink by an Ag sinter interconnect and thus allows a very compact and light design of power electronic systems.