Thermal modeling of BOX/DTI enclosed power devices with Green's function approach

Accurate thermal models for power devices are crucial due to the simultaneous introduction of deep trenches (DTI) and silicon on insulator (SOI) technology. A computationally efficient geometry dependent thermal model is presented that avoids the time and cost penalty of numerical thermal simulations and utilizes the Green's function approach in combination with mixed boundary conditions. The derived model is accurate (relative temperature error <;10%) and valid for dimensions ranging between 5μm and 200μm. The new model allows for on-the-fly calculations of the thermal resistance R
_th
as well as thermal coupling coefficients for multi-finger devices, enabling predictive modeling and concurrent engineering.