Modeling and design of coplanar structure in QFP80 package for RFIC applications

A 6-Gb/s packaging solution that uses low cost quad flat pack (QFP) technology is presented. Due to the large inductance, such a high speed is beyond the reach of traditional QFP package designs. A coplanar transmission line structure used for leads optimization has been developed. Both traditional and optimized structures have been modeled and analyzed. The simulation results show that the optimized structure has extended the RFIC package bandwidth up to 6.1GHz (at -15dB).