A hybrid full-wave analysis of via hole grounds using finite difference and finite element time domain methods

A hybrid full-wave analysis using FDTD (finite difference time domain) and FETD (finite element time domain) methods has been developed to analyze microwave devices with locally arbitrarily shaped three-dimensional structures. This method is applied to calculate the scattering parameters of cylindrical via hole grounds. The comparison of the results with the mode matching data and FDTD staircasing data verifies the accuracy of this analysis.