Numerical analysis and experimental verification of ISC(Integrated Smart Card) during bending and twist test

Recently, Advancements in information technology increasingly compact, lightweight, easy to pursuing the needs of users as (Needs) to meet the complex application of various types of products have been released. In this study, Numerical analysis of stress distribution and to optimize the location of the inserted device use to consisting of PVC material on the card and load displacement. In addition, through the bending test to evaluate the reliability of the specimen was carried out the validation of numerical analysis.