Thermo-mechanical Stress Analysis for Planar Metallization in Integrated Power Electronics Modules

Power switching devices, passive power components and EMI filters can all been integrated into planar power modules by utilizing planar integration technology. Planar metallization on brittle substrates is the major feature of integrated power electronics modules. Mechanical properties of interfaces between deposited metal traces and substrates are critical for reliable operation. This paper investigates the values of thermo-mechanical stresses in simplified structures by theoretical calculation and Finite Element Modeling (FEM) simulation. In-plane stress and peel stress are addressed as the failure indicators for delamination and cracks respectively.