Defect level prediction of printed circuit board assembly manufacturing based on DPMO metric

Companies in the electronics industry need to plan production test strategy for new products in early design phase even before any designs are actually finalized. This paper presents a defect level prediction tool based on Defects per Million Opportunities (DPMO) metric, which is intended for newly designed printed circuit board assemblies (PCBAs), especially ones determined for automotive industry. Due to this tool is possible to analyze and assess test strategy alternatives by using the estimated defects.