Reliability of micromechatronic systems with chip on molded interconnected devices and flexible substrates

Aim of the research work is to determine the influence of thermo-mechanical stress on different assembly variants on the reliability of the micromechatronic system by thermo-mechanical stress analysis with combined simulation of the assembly. Therefore, four different assemblies are examined each on four different substrates, two substrate materials for MID and two flexible substrates. The frame of the examination is the simulation with proofed material data and the real assemblies for verifying the results of the simulation during application specific environmental conditions. To gain data from the real assemblies, a special tension detection chip with strain gauges has been adapted for the requirements of the research project. The matching of the simulation and the real assembly is done by measuring the resulting tension in the chip during thermal cycling of the assemblies. By the use of the verified simulation, accurate predictions concerning the reliability of assemblies with other chip sizes or different materials and other geometric influences on the micromechatronic system can be made.