Advanced solutions for 3D integration of heterogeneous individual chips

A collection of slides from the author's conference presentation is given. The topics discussed includes: 3D integration of heterogeneous individual chips, SOC, silicon mother board, Si interposer technologies, active silicon interposer, direct bonding techniques, molecular Cu-Cu bonding, fine pitch, high density TSV's, embedded wafer level packaging, embedded chip technologies, packaging trends, chip in wafer for integrated system, CIWIS process, 3D wafer level packaging, high density interconnects, and via belt technology.