Study of power/ground plane separation on radiated emission suppression

In today's high-speed board design, decoupling using on-board capacitors are necessary to provide stable DC power and to suppress radiated emission from the board. At the higher frequency beyond 300 MHz, one has to rely on the capacitance offered by the power-ground plane pair in multi-layer stackup to provide effective decoupling. This paper provides an in-depth analysis on the suppression of board emission with the reduction of plane separation.