Characterization of chip-to-chip wireless interconnections based on capacitive coupling

3D chip-to-chip capacitive interconnections are in common practice characterized with FEM solvers as they cannot be modeled as lumped RLC circuits as ohmic 3D interconnects. This paper describes some drawbacks of this procedure and proposes an innovative flow, based on post-layout parasitic extraction tools, to enable the designer to place capacitive interconnects as constrained macros in a digital design flow.