Hybrid silicon lasers: Integration of III–V and silicon photonics using wafer bonding

This talk will give an overview of the hybrid silicon laser device platform which heterogeneously integrates InP with SOI to fabricate silicon photonic chips with integrated lasers. Challenges associated with this integration will be discussed as well as examples of integrating hybrid silicon lasers with other silicon photonic components on the path to achieving a terabit silicon photonic link.