Development platform for WIP bond quality testing system

Development of a work in progress (WIP) quality testing system is complex and requires significant effort in design, coding and integration the software with hardware components. On top of that, various regulations and testing procedures need to be observed during the testing. This paper presents a distributed control application platform (DCAP) to improve the development time and allow reusability. The platform includes building blocks, template libraries, best practices, and design patterns which can be easily deployed in various applications. A case study of developing a semiconductor WIP bond quality testing system was used to validate the platform together with an industrial partner. The result shows that a configurable, flexible and extensible WIP bond quality testing system can be developed using the platform in a shorter period of time. The WIP quality testing system can be configured to perform both destructive and non-destructive testing of wire bonding, ball bonding and die bonding by applying force to measure. The DCAP platform helps in providing the building blocks for manufacturing execution and control applications. The cross-platform nature with extensibility and flexibility features will help in various future industrial and research applications development.