Conformal deposition of electroless barrier and seed layers in TSV with Au nano particle catalyst

Low cost and low temperature fabrication process is required for TSV. In this study, we propose a low temperature deposition of barrier and copper seed layers by wet process only using electroless plating. Moreover, we use AuNPs as a catalyst which is densely adsorbed on SiO
₂
sidewall of TSV with SAM. We succeeded in conformal deposition of barrier and seed layers, and this method is effective for realizing a low resistance Cu-filled TSV.