Three-dimensional characterization of crystalline grains in sub-100 nm Cu lines by Transmission Electron Microtomography

The high resolution Transmission Electron Microtomography (TEMT) for characterization of grains in a Cu sub-100nm line was firstly reported. A new sample preparation method was developed for obtaining TEM projections from the tilted sample from -90 to +90 degrees. A Cu grain structure was become clear by the 3D TEMT. Furthermore grooving at the surface and micro voids of a few nm were found at the grain boundaries.